Imaging apparatus and vehicle

An imaging apparatus comprising:

• an imaging optical system;
• an image sensor;
• a plurality of circuit boards including a first circuit board the image sensor and a first electronic component mounted thereon;
• and
• a housing including an opening that exposes the imaging optical system to a subject, the housing that supports the imaging optical system, the image sensor, and the plurality of circuit boards, wherein
• a first heat transfer member is integrally disposed with an inner wall of the housing, and comprises a portion being longitudinal in an optical axis direction of the imaging optical system, and a radial portion directly connected to the longitudinal portion that extends in direction radially inward when viewed in a cross section of the optical axis, such that the longitudinal portion extends in a direction away from the radial portion and towards the imaging optical system, and
• the imaging apparatus further comprises a second heat transfer member comprising a heat transfer plate, a first planar heat transfer sheet, and a second planar heat transfer sheet, the first and second planar heat transfer sheets being disposed directly on opposite main surfaces of the heat transfer plate, wherein
• the heat transfer plate is in contact with the first heat transfer member,
• the first planar heat transfer sheet is in contact with the first electronic component,
• the second planar heat transfer sheet is in contact with a second electronic component included in a second circuit board other than the first circuit board including the first electronic component, and
• a surface where the second electronic component is mounted faces a surface where the first electronic component is mounted.

A vehicle having an imaging apparatus mounted thereon, the imaging apparatus including an imaging optical system, an image sensor, a plurality of circuit boards including a first circuit board the image sensor and a first electronic component mounted thereon, and a housing including an opening that exposes the imaging optical system to a subject, the housing that supports the imaging optical system, the image sensor, and the plurality of circuit boards, wherein

• a first heat transfer member is integrally disposed with an inner wall of the housing, and comprises a portion being longitudinal in an optical axis direction of the imaging optical system, and a radial portion directly connected to the longitudinal portion that extends in direction radially inward when viewed in a cross section of the optical axis, such that the longitudinal portion extends in a direction away from the radial portion and towards the imaging optical system, and
• the imaging apparatus further comprises a second heat transfer member comprising a heat transfer plate, a first planar heat transfer sheet, and a second planar heat transfer sheet, the first and second planar heat transfer sheets being disposed directly on opposite main surfaces of the heat transfer plate, wherein
• the heat transfer plate is in contact with the first heat transfer member,
• the first planar heat transfer sheet is in contact with the first electronic component,
• the second planar heat transfer sheet is in contact with a second electronic component included in a second circuit board other than the first circuit board including the first electronic component, and
• a surface where the second electronic component is mounted faces a surface where the first electronic component is mounted.