Element substrate

An element substrate comprising a heat generating resistor that generates thermal energy for ejecting a liquid,

• wherein the heat generating resistor is a stacked structure having stacked a plurality of resistor layers including a first resistor layer showing a resistance value decreasing tendency by driving and a second resistor layer showing a resistance value increasing tendency by driving.

An element substrate comprising a heat generating resistor that generates thermal energy for ejecting a liquid,

• wherein the heat generating resistor is a stacked structure having stacked a plurality of resistor layers including a first resistor layer and a second resistor layer, each containing a metal silicon nitride and the first resistor layer and the second resistor layer being different in at least one of a silicon content in the metal silicon nitride and a metal element contained in the metal silicon nitride,
• wherein the first resistor layer and the second resistor layer are different from each other in the silicon content in the metal silicon nitride, and
• wherein the silicon content in the first resistor layer is from 35 at % to 45 at % and the silicon content in the second resistor layer is from 15 at % to 25 at %.

An element substrate comprising a heat generating resistor that generates thermal energy for ejecting a liquid,

• wherein the heat generating resistor is a stacked structure having stacked a plurality of resistor layers including a first resistor layer and a second resistor layer, each containing a metal silicon nitride and the first resistor layer and the second resistor layer being different in at least one of a silicon content in the metal silicon nitride and a metal element contained in the metal silicon nitride, and
• wherein the first resistor layer shows a resistance value decreasing tendency by driving and the second resistor layer shows a resistance value increasing tendency by driving.