Resin mold
AssigneeAsahi Kasei E-Materials Corporation
InventorsShinji Matsumoto, Jun Koike
Life of this patent
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Abstract
To provide a resin mold which is excellent in adhesion to a substrate, excellent in release properties from a transfer material resin, further excellent in durability of the resin mold itself, and which endures repetition transfer to the transfer material resin, a resin mold of the invention is a resin mold having a fine concavo-convex structure on the surface, and is characterized in that the fluorine element concentration (Es) in a resin mold surface portion is the average fluorine element concentration (Eb) in the resin forming the resin mold or more.
Claims18
A method of manufacturing a resin mold containing a substrate and a cured material deposited on said substrate and having a fine concavo-convex structure on a surface of the cured material, comprising:
- coating said substrate or a master mold with a photopolymerizable mixture containing fluorine-non-containing (meth)acrylate, fluorine-containing (meth)acrylate, and a photoinitiator,
- migrating or diffusing the fluorine-containing (meth) acrylate to the surface of the photopolymerizable mixture coated on said substrate or the master mold by performing pre-baking after coating the substrate with the resin composition;
- pressing the photopolymerizable mixture between said substrate and the master mold;
- obtaining the cured material by curing the photopolymerizable mixture by exposure;
- applying pre-peeling heating treatment to the cured material during the time between curing and peeling;
- peeling off the cured material with said substrate from the master mold at a certain velocity to obtain the resin mold;
- and
- performing post-peeling heat treatment to the resin mold after peeling, wherein the fluorine element concentration (Es) in a resin mold surface portion is more than an average fluorine element concentration (Eb) in the resin mold, wherein
- said resin mold surface portion means a portion in the range of 2 nm to 20 nm in the thickness direction perpendicular to the surface of the resin mold, and
- a ratio between Eb and Es satisfies equation (1):
- 30≤Es/Eb≤160. Eq.(1)
A method of manufacturing an (n)th generation resin mold, in which n is more than two, containing a substrate and a cured material deposited on said substrate and having a fine concavo-convex structure on a surface of the cured material, comprising:
- coating said substrate or an (n−1)th generation resin mold with a photopolymerizable mixture containing fluorine-non-containing (meth)acrylate, fluorine-containing (meth)acrylate, and a photoinitiator,
- migrating or diffusing the fluorine-containing (meth) acrylate to the surface of the photopolymerizable mixture coated on said substrate or the (n−1)th generation resin mold;
- pressing the photopolymerizable mixture between said substrate and the (n−1)th generation resin mold by performing pre-baking after coating the substrate with the resin composition;
- obtaining the cured material by curing the photopolymerizable mixture by exposure;
- applying pre-peeling heating treatment to the cured material during the time between curing and peeling;
- peeling off the cured material with the (n−1)th generation resin mold from the (n−1)th generation resin at a certain velocity to obtain the resin mold, wherein the fluorine element concentration (Es) in a resin mold surface portion is more than an average fluorine element concentration (Eb) in the resin mold;
- and
- performing post-peeling heat treatment to the resin mold after peeling, wherein
- said resin mold surface portion means a portion in the range of 2 nm to 20 nm in the thickness direction perpendicular to the surface of the (n)th generation resin mold, and
- a ratio between Eb and Es satisfies equation (1):
- 30≤Es/Eb≤160. Eq.(1)
Dependencies are inferred from the claim text.