Spectra based endpointing for chemical mechanical polishing
AssigneeApplied Materials, Inc.
InventorsBoguslaw A. Swedek, Dominic J. Benvegnu, Jeffrey Drue David
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AssigneeApplied Materials, Inc.
InventorsBoguslaw A. Swedek, Dominic J. Benvegnu, Jeffrey Drue David
Estimating the term…
A computer implemented method of monitoring a polishing process includes, for each sweep of a plurality of sweeps of an optical sensor across a substrate undergoing polishing, obtaining a plurality of current spectra, each current spectrum of the plurality of current spectra being a spectrum resulting from reflection of white light from the substrate, for each sweep of the plurality of sweeps, determining a difference between each current spectrum and each reference spectrum of a plurality of reference spectra to generate a plurality of differences, for each sweep of the plurality of sweeps, determining a smallest difference of the plurality of differences, thus generating a sequence of smallest difference, and determining a polishing endpoint based on the sequence of smallest differences.
A computer program product encoded in a non-transitory machine-readable medium, the product comprising instructions operable to cause a processor to:
A computer program product encoded in a non-transitory machine-readable medium, the product comprising instructions operable to cause a processor to:
A computer program product encoded a non-transitory machine-readable medium, the product comprising instructions operable to cause a processor to:
Dependencies are inferred from the claim text.