Solder alloy, solder and method for producing same
AssigneeShanghai Phichem Material Co., Ltd.
InventorYongchang Zhou
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Abstract
The present invention discloses a solder alloy, solder and a method for producing the same, and belongs to the field of solder. The solder alloy contains 0.9-4.1 wt % of silver, 0.3-1 wt % of copper, 0.02-0.085 wt % of rhodium, and the balance being tin, based on the total weight of the solder alloy being 100 wt %. After the solder formed by the solder alloy of the present invention is subjected to multiple reflows and tested by a ball shear test, the residual tin in the solder joint could reach at least 95%, which meets the ball shear standards required by AEC-Q100.
Claims18
A solder alloy, comprising:
- 0.9-4.1 wt % of silver, 0.3-0.7 wt % of copper, 0.02-0.085 wt % of rhodium, and the balance of wt % being substantially tin, based on the total weight of the solder alloy being 100 wt %.
Solder being formed by a solder alloy comprising 0.9-4.1 wt % of silver, 0.3-0.7 wt % of copper, 0.02-0.085 wt % of rhodium, and the balance of wt % being substantially tin, based on the total weight of the solder alloy being 100 wt %.
Dependencies are inferred from the claim text.