Substrate processing method and substrate processing apparatus

A substrate processing method, comprising:

• a liquid film forming step of forming a liquid film puddle of a rinsing liquid on a pattern forming surface of a substrate formed with a pattern;
• a liquid pool forming step of forming a liquid pool of an organic solvent by supplying the organic solvent to the liquid film puddle near a center of rotation of the substrate while maintaining the puddle;
• after the liquid pool forming step, a replacement step of replacing the rinsing liquid constituting the liquid film with the organic solvent by supplying the organic solvent to the liquid pool while rotating the substrate at a rotational speed higher than in the liquid pool forming step;
• an application step of applying a filler solution to the pattern forming surface coated with the organic solvent;
• a filling step of causing a filler contained in the filler solution and applied to the pattern forming surface to sink and fill concave portions of the pattern with the filler;
• a rinsing step of rinsing the pattern forming surface by supplying the rinsing liquid to the pattern forming surface while rotating the substrate at a first rotational speed, wherein:
• the liquid film forming step includes a step of decelerating the rotational speed of the substrate to a second rotational speed lower than the first rotational speed, the step being performed following the rinsing step;
• the liquid pool forming step includes a step of setting the rotational speed of the substrate equal to or lower than the second rotational speed;
• and
• the rotation of the substrate is stopped and the organic solvent is supplied in the liquid pool forming step.