Circuit board assembly of a multiple viewing elements endoscope

An assembly for a tip section of an endoscope, the assembly comprising:

• a printed circuit board configured to move from an unfolded configuration to a folded configuration, the printed circuit board comprising:
• a carrier including a first arm, a second arm, and a base connecting the first arm and the second arm,
• a first strip connected to the first arm,
• a first panel connected to the first strip,
• a second strip connected to the second arm, and
• a second panel connected to the second strip, wherein in the folded configuration of the printed circuit board, the first and second strips extend transverse to the carrier, the first panel extends transverse to the first strip, and the second panel extends transverse to the second strip;
• a plurality of illuminators, wherein each of the front carrier, the first panel, and the second panel has at least one illuminator mounted thereon;
• at least one image sensor, wherein the at least one image sensor is received between opposing edges of the printed circuit board;
• and
• a heat sink configured to receive the printed circuit board.

An assembly for a tip section of an endoscope, the assembly comprising:

• a printed circuit board configured to move from an unfolded configuration to a folded configuration, the printed circuit board comprising, when in the folded configuration:
• a distal planar portion, and
• at least one proximal planar portion, the at least one proximal planar portion extending perpendicular to the distal planar portion;
• a heat sink configured to receive the printed circuit board, the heat sink comprising:
• a distal-facing end surface,
• a first side extending proximally from the distal-facing end surface,
• a second side extending proximally from the distal-facing end surface, wherein the first and second sides extend proximally from opposite sides of the distal-facing end surface, and
• at least one recess formed in at least one of the first and second sides;
• wherein the heat sink receives the printed circuit board such that the distal planar portion of the printed circuit board covers at least a portion of the distal-facing end surface of the heat sink, and the at least one proximal planar portion is received within the at least one recess of the heat sink.