Optoelectronic component with a first potting material covering parts of a first optoelectronic semiconductor chip and a second potting material covering the first potting material

An optoelectronic component comprising:

• a carrier;
• a first optoelectronic semiconductor chip that is a volume emitting light-emitting diode chip and has a top side, and a second optoelectronic semiconductor chip that is a surface emitting light-emitting diode chip and a top side of the second optoelectronic semiconductor chip is a radiation emission side arranged above a top side of the carrier, wherein the optoelectronic semiconductor chips each comprise an underside situated opposite the top side and side faces extending between the top side and the underside, and the undersides of the optoelectronic semiconductor chips face the top side of the carrier;
• a first potting material arranged above the top side of the carrier, said first potting material covering parts of the side faces of the first optoelectronic semiconductor chip, wherein the side faces of the second optoelectronic semiconductor chip are not covered by the first potting material;
• and
• a second potting material arranged above the top side of the carrier, and said second potting material covering the first potting material, wherein the second potting material terminates flush with the top sides of the first optoelectronic semiconductor chip and the second optoelectronic semiconductor chip.