Stacked package structure and stacked packaging method for chip

A method of making a stacked package structure, the method comprising:

• a) providing a substrate having a first surface and a second surface opposite thereto;
• b) arranging a first die on said first surface of said substrate such that said substrate supports said first die, wherein said first die comprises an active face and a back face opposite thereto, said back face of said first die is bonded to said first surface of said substrate by only an adhesive layer, and said active face of said first die comprises pads;
• c) forming a first enclosure to, together with said adhesive layer, encapsulate said first die;
• d) forming at least one interlinkage that extends to the inside of said first enclosure and is electrically coupled to said pads;
• e) forming at least one first redistribution body, and electrically coupling said first redistribution body to said interlinkage, wherein said first redistribution body is partially exposed on said surface of said stacked package structure to provide outer pins for electrically coupling to printed-circuit board (PCB) external circuitry;
• f) forming at least one penetrating body that penetrates said first enclosure and said substrate;
• and
• g) electrically coupling at least one electrode on a second die to a first terminal of said penetrating body, wherein a second terminal of said penetrating body is partially exposed on said surface of said stacked package structure to provide said outer pins, wherein each of said outer pins comprises a solder layer on a metal layer, wherein a vertical thickness of said metal layer is greater than a vertical thickness of said solder layer, and wherein said vertical thickness of said metal layer is predetermined such that said output pins are configured to be electrically and directly connected to said PCB external circuitry,
• h) wherein said second die is arranged below said second surface of said substrate, said second die comprises an active face and a back face opposite thereto, said active face of said second die is closer than said back face of said second die to said second surface of said substrate, said active face of said second die comprises at least one electrode, and each said electrode on said second die is not electrically coupled to said back face of said first die.