US 10,763,201 B2Granted

Lead and lead frame for power package

AssigneeLittelfuse, Inc.

InventorsNathan Zommer, Kang Rim Choi

Life of this patent

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Abstract

A power device includes a semiconductor chip provided over a substrate, and a patterned lead. The patterned lead includes a raised portion located between a main portion and an end portion. At least part of the raised portion is positioned over the semiconductor chip at a larger height than both the main portion and the end portion. A bonding pad may also be included. The end portion may include a raised portion, bonded portion, and connecting portion. At least part of the bonded portion is bonded to the bonding pad and at least part of the raised portion is positioned over the bonding pad at a larger height than the bonded portion and connecting portion. The end portion may also include a plurality of similarly raised portions.

Claims18

Dependent claims

A power device comprising:

an encapsulating material;
and
a semiconductor chip;
and
a lead comprising a main portion, a first raised portion, and an end portion having a connecting portion, a second raised portion, and a bonded portion, wherein the main portion is separated from the end portion by the first raised portion, wherein the first raised portion extends from the connecting portion towards the main portion along a first direction, wherein the second raised portion extends from the connecting portion towards the bonded portion along a second direction, wherein the bonded portion is separated from the connecting portion by the second raised portion, wherein the first direction and the second direction are nonparallel, wherein the lead is part of leadframe metal, and wherein the main portion extends from outside the encapsulating material, wherein the bonded portion is electrically connected to the semiconductor chip, wherein the lead is not electrically connected to the semiconductor chip at the main portion, the first raised portion, the connecting portion or at the second raised portion.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/821,822Filed 23 Nov 2017 · continuation
Priority: 3 Mar 2009
Published: US 2018/0096918 A15 Apr 2018
Granted: 1 Sep 2020
Term ends: Not estimatedThe source records don’t support an estimate.

Classification26 codes

H10W 70/65
Characterised by their interconnections: shapes or dispositions of interconnections
H10W 70/421
Leadframes: shapes or dispositions
H10W 70/427
Cross-sectional shapes: bent parts
H10W 70/466
Additional interconnections in combination with leadframes: tape carriers or flat leads

Family

Application61/157,115Us provisional application · filed 3 Mar 2009
Application12/562,049Parent of this continuation · filed 17 Sep 2009
Application14/320,644Parent of this continuation · filed 1 Jul 2014
US 8,796,837 B2Parent of this continuation · filed 5 Aug 2014
US 2018/0096918 A1Pre-grant publication · published 5 Apr 2018
US 9,842,795 B2Parent of this continuation
US 2010/0224982 A1Published application
US 2014/0312477 A1Published application
US 10,763,201 B2This patent

From the US filing history. Foreign family members aren’t listed.

Timeline

Citations

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