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US 10,763,200 B2Granted
Mounting structure and module
AssigneeFujikura Ltd.
InventorKohei Matsumaru
Life of this patent
Estimating the term…
Abstract
A mounting structure includes a semiconductor device including a first terminal, a wiring substrate including a second terminal having a first end, a wiring extracted from an end face of the first end, and a photosensitive insulating film that covers the wiring and the first end, the second terminal being disposed facing the first terminal, and a bump that electrically connects the first terminal and the second terminal.
Claims8
A mounting structure comprising:
- a semiconductor device including a first terminal;
- a wiring substrate including a second terminal having a first end, a wiring extracted from an end face of the first end, and a photosensitive insulating film that covers the wiring and the first end, the second terminal being disposed facing the first terminal, the second terminal and the wiring being provided on one surface of the wiring substrate such that the second terminal and the wiring are in direct contact with the one surface of the wiring substrate;
- and
- a bump that electrically connects the first terminal and the second terminal.
1 more element
Dependencies are inferred from the claim text.