Vertical semiconductor devices and method of manufacturing the same

A vertical semiconductor device comprising:

• a substrate;
• a conductive pattern structure in which insulation patterns and conductive patterns are stacked alternately and repeatedly on the substrate, wherein the conductive patterns extend in a first direction parallel to an upper surface of the substrate, edge portions of the conductive patterns have a stair-stepped shape in the first direction and in a second direction perpendicular to the first direction and parallel to the upper surface of the substrate, and the conductive patterns include pad regions corresponding to upper surfaces of stairs, respectively;
• pad conductive patterns on the pad regions of the conductive patterns, respectively;
• mask patterns on the pad conductive patterns, respectively;
• contact plugs contacting the pad conductive patterns, respectively, and electrically connected to the conductive patterns, respectively;
• a first spacer on a wall of an upper stair contracting each of the pad regions corresponding to an upper surface of an uppermost stair in the second direction;
• and
• a second spacer on walls of upper stairs contacting each of the pad regions corresponding to an upper surface of the stair below the uppermost stair in the second direction.

A vertical semiconductor device comprising:

• a substrate;
• a conductive pattern structure in which insulation patterns and conductive patterns are stacked alternately and repeatedly on the substrate, wherein the conductive pattern structure includes an edge portion having a stair-stepped shape, and each of the conductive patterns includes a pad region corresponding to an upper surface of a stair in the edge portion;
• a spacer on a sidewall of the stair and contacting side surfaces of at least one conductive pattern of the conductive patterns and at least one insulation pattern of the insulation patterns;
• a pad conductive pattern on the pad region and disposed remotely from the spacer;
• a mask pattern on an upper surface of the pad conductive pattern;
• and
• a contact plug penetrating the mask pattern to contact the pad conductive pattern.