Electronic component mounter and electronic component release method

An electronic component mounter comprising:

• a suction nozzle configured to pick up an electronic component housed in a housing section that houses multiple of the electronic components that are to be mounted on a circuit board;
• a switching device configured to switch air supplied to a nozzle hole of the suction nozzle to negative pressure air when picking up the electronic component, and to switch the air supplied to the nozzle hole of the suction nozzle to positive pressure air when mounting the electronic component that was picked up by the suction nozzle on the circuit board;
• and
• a blow supply device configured to supply at least a first blow to the suction nozzle for a specified time when the positive pressure air is being supplied to the nozzle hole by the switching device when mounting the electronic component, then, after the specified time has elapsed, stop the first blow and supply a second blow with a lower pressure than the first blow to the suction nozzle,
• wherein the blow supply device includes
• a first opening and closing valve provided between the suction nozzle and the positive pressure supply source, and
• a second opening and closing valve provided between the suction nozzle and the positive pressure supply source parallel to the first opening and closing valve,
• wherein the first blow is supplied by opening the first opening and closing valve and by opening the second opening and closing valve, and
• wherein the second blow is supplied by closing the first opening and closing valve and by opening the second opening and closing valve.