Flexible hybrid electronic system and method of reducing the impact thereof

A flexible hybrid electronic system, comprising:

• a first redistribution structure, disposed on a first region of a carrier;
• a first device, disposed on the first redistribution structure;
• a first encapsulation layer, encapsulating the first device, and covering the first device and the first redistribution structure;
• a first material layer, covering the first encapsulation layer and the first device, the first material layer having a first thickness T1′ and a first Young's modulus Y1′;
• and
• a second material layer, covering the first material layer, the second material layer having a second thickness T2′ and a second Young's modulus Y2′,
• wherein the first device and a portion of the first encapsulation layer from a top surface of the first redistribution structure to a top surface of the first device is a first portion, and the first portion has a third thickness T3 and has a third Young's modulus Y3,
• wherein
• a ratio of Y3/Y2′ is between 0.18 and 0.22;
• a ratio of Y3/Y1′ is between 280.62 and 342.98;
• a ratio of T3/T2′ is between 2.34 and 2.86;
• and
• a ratio of T3/T1′ is between 0.72 and 0.88.

A method of reducing impact of a flexible hybrid electronic system, wherein the flexible hybrid electronic system comprises:

• at least one device, disposed on a plurality of regions of a carrier;
• a plurality of redistribution structures, respectively disposed between the carrier and the at least one device;
• and an encapsulation layer, encapsulating the at least one device, and covering the at least one device and the redistribution structures,
• the method comprises:
• using a first device having a highest top surface among the at least one device as a reference, wherein the carrier below the first device has a first thickness T1 and a first Young's modulus Y1, and a first redistribution structure between the first device and the carrier has a second thickness T2 and a second Young's modulus Y2;
• defining the first device and a portion of the encapsulation layer from a top surface of the first redistribution structure to a top surface of the first device as a first portion, the first portion having a third thickness T3 and having a third Young's modulus Y3;
• defining another portion of the encapsulation layer from the top surface of the first device to a top surface of the encapsulation layer as a second portion, the second portion having a fourth thickness T4 and having a fourth Young's modulus Y4;
• adjusting Y1, Y2, Y3 and Y4 so that
• a ratio of Y3/Y4 is between 1.62 and 1.98;
• a ratio of Y3/Y2 is between 0.18 and 0.22;
• and
• a ratio of Y3/Y1 is between 280.62 and 342.98;
• and
• adjusting T1, T2, T3 and T4 so that
• a ratio of T3/T4 is between 1.98 and 2.42;
• a ratio of T3/T2 is between 2.34 and 2.86;
• and
• a ratio of T3/T1 is between 0.72 and 0.88.