Semiconductor device capable of reducing a temperature difference among semiconductor chips

A semiconductor device comprising:

• a first semiconductor chip;
• a second semiconductor chip;
• a third semiconductor chip;
• a collector pattern electrically connected to a collector of the first semiconductor chip, a collector of the second semiconductor chip, and a collector of the third semiconductor chip;
• an emitter pattern electrically connected to an emitter of the first semiconductor chip, an emitter of the second semiconductor chip, and an emitter of the third semiconductor chip;
• a gate pattern electrically connected to a gate of the first semiconductor chip and a gate of the third semiconductor chip;
• a first diode having an anode electrically connected to the gate pattern and a cathode electrically connected to a gate of the second semiconductor chip;
• and
• a second diode connected in reverse parallel with the first diode, wherein
• the second semiconductor chip is provided between the first semiconductor chip and the third semiconductor chip.