Composition for adhesion, stacked structure using the same, and electronic device using the same

A composition for adhesion, comprising:

• an acrylic resin, the acrylic resin having a weight average molecular weight of about 100,000 g/mol to about 200,000 g/mol, the acrylic resin including a polymerization unit derived from a monomer represented by Formula A1 and a polymerization unit derived from a monomer represented by Formula A2,
• in Formula A1,
• R11 is a hydroxyalkyl group of 1 to 6 carbon atoms, and
• R21 is hydrogen, deuterium, or an alkyl group of 1 to 3 carbon atoms,
• in Formula A2,
• R12 is an alkyl group of 1 to 6 carbon atoms, and
• R22 is hydrogen, deuterium, or an alkyl group of 1 to 3 carbon atoms;
• and
• a silane compound, the silane compound having a weight average molecular weight of about 300 g/mol to about 2,000 g/mol, the silane compound including a polymerization unit derived from a monomer represented by Formula B,
• in Formula B,
• R100, R101, and R102 are each independently an alkyl group of 1 to 6 carbon atoms,
• R200 and R201 are each independently one of hydrogen, deuterium or an alkyl group of 1 to 3 carbon atoms, and
• L1 is a single bond or an alkyl group of 1 to 4 carbon atoms.