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US 10,590,541 B2Granted
Electroless copper plating compositions and methods for electroless plating copper on substrates
AssigneeRohm and Haas Electronic Materials LLC
InventorsAlejo M. Lifschitz Arribio, Donald E. Cleary
Life of this patent
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Abstract
Stable electroless copper plating baths include di-cation viologen compounds to improve rate of copper deposition on substrates. The copper from the electroless plating baths can be plated at low temperatures and at high plating rates.
Claims10
An electroless copper plating composition comprising one or more sources of copper ions, one or more di-cation viologen compounds having a formula:
- wherein R is selected from the group consisting of linear or branched (C1-C10)alkyl, linear or branched hydroxy(C1-C10)alkyl, linear or branched alkoxy(C1-C10)alkyl, linear or branched carboxy(C1-C10)alkyl, benzyl, amino and cyano, a counter anion(s) to neutralize the one or more di-cation viologen compounds, one or more complexing agents, one or more reducing agents, and, optionally, one or more pH adjusting agents, wherein a pH of the electroless copper plating composition is greater than 7.
A method of electroless copper plating comprising:
- a) providing a substrate comprising a dielectric;
- b) applying a catalyst to the substrate comprising the dielectric;
- c) applying an electroless copper plating composition to the substrate comprising the dielectric, wherein the electroless copper plating composition comprises one or more sources of copper ions, one or more di-cation viologen compounds having a formula:
- wherein R is selected from the group consisting of linear or branched (C1-C10)alkyl, linear or branched hydroxy(C1-C10)alkyl, linear or branched alkoxy(C1-C10)alkyl, linear or branched carboxy(C1-C10)alkyl, benzyl, amino and cyano, a counter anion(s) to neutralize the one or more di-cation viologen compounds, one or more complexing agents, one or more reducing agents, and, optionally, one or more pH adjusting agents, wherein a pH of the electroless copper plating composition is greater than 7;
- and
- d) electroless plating copper on the substrate comprising the dielectric with the electroless copper plating composition.
3 more elements
Dependencies are inferred from the claim text.