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US 10,543,095 B2Granted
Orthopedic implant and method of producing the implant
OwnerMilija Mitrovicinventor
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OwnerMilija Mitrovicinventor
Estimating the term…
An orthopedic implant in the form of a hip joint endoprosthesis includes a ceramic head set onto an anchoring shaft, which is configured and adapted to be inserted and anchored into a bone. The head has an inner blind recess. The anchoring shaft has a tenon. A metallic sleeve having an approximately central through-bore is soldered into the recess of the head. The tenon of the anchoring shaft is inserted and secured in the bore of the sleeve. The head is made of a ceramic based on zirconium dioxide, aluminum oxide or a mixed ceramic, while the sleeve is made of a high strength titanium material. A connection between the head and the sleeve is produced by a silicate ceramic solder that solidifies or hardens in a ceramic firing, and by a subsequently applied glass solder, of which the excess can exit from the recess via the through-bore into a hollow space existing between the sleeve and the tenon.
An orthopedic implant configured as a femoral component of a hip joint endoprosthesis, said orthopedic implant comprising:
An orthopedic implant configured as a femoral component of a hip joint endoprosthesis comprising an anchoring shaft, and a head consisting of a ceramic material, which is set onto the anchoring shaft, which is configured to be inserted into a bone and anchorable therein, wherein the ceramic head comprises a cylinder-shaped blind-hole-type inner recess and the anchoring shaft has a tenon that is inserted into this recess, wherein a similarly cylinder-shaped metallic sleeve is soldered into the recess of the head, via which sleeve the ceramic head is connected with the tenon, wherein the sleeve is pre-coated by a first silicate glass solder that solidifies or hardens in a ceramic firing, wherein the connection between the ceramic head and the sleeve is produced via a second silicate glass solder, and wherein a covering surface of the sleeve comprises a central through-bore through which excess liquid second glass solder can escape into a hollow space existing between the sleeve and the tenon of the anchoring shaft.
Dependencies are inferred from the claim text.