Temperature adjustment method using wet surface in a processing chamber

A temperature adjustment method comprising:

• forming a wet surface wet with a cooling medium by supplying the cooling medium to a rear surface of a temperature adjustment surface of a component member in a processing chamber of a substrate processing device comprising the processing chamber which performs predetermined processing on a substrate and is vacuum-exhaustible;
• and
• adjusting a temperature of the temperature adjustment surface due to latent heat of evaporation of the cooling medium by evaporating the cooling medium which forms the wet surface by adjusting a pressure in an evaporation chamber which isolates the wet surface from an atmosphere around the wet surface,
• wherein the cooling medium is supplied to the rear surface by surface tension by making the rear surface as un uneven surface on which a plurality of convex portions are formed, and providing a cooling medium container which contains the cooling medium which is disposed in the evaporation chamber while the convex portions are partially immersed in the cooling medium container, or
• wherein the cooling medium is supplied to the rear surface by providing a plurality of shower devices in which an upper portion is attached to the rear surface, a middle portion is extended from the upper portion downward, a lower portion is extended side by side from the bottom of the middle portion, and the cooling medium is sprayed from a nozzle of the lower portion upward to wet the rear surface, or
• wherein the cooling medium is supplied to the rear surface by disposing a porous layer to contact the rear surface, water is supplied as the cooling medium from a water supply source to the porous layer to exude out from a surface of the porous layer, with the surface of the porous layer being adjacent to an evaporation room, and thus the wet surface wet with the water is formed on the surface of the porous layer.