Pellicle for EUV mask and fabrication thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Tsung Shih, Shinn-Sheng Yu, Jeng-Horng Chen, Anthony Yen
Life of this patent
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Abstract
The present disclosure provides a method in accordance with some embodiments. A wafer is grinded from a back side. The wafer is inserted into an opening defined by a frame holder. The frame holder is attached to a carrier through a temporary layer. A front side of the wafer is attached to the temporary layer. Thereafter, the wafer is etched from the back side until the wafer reaches a predetermined thickness. Thereafter, the frame holder and the wafer therein are separated from the temporary layer and the carrier.
Claims20
A method, comprising:
- grinding a portion of a wafer from a back side;
- thereafter inserting the portion of the wafer into an opening defined by a frame holder, wherein the frame holder is attached to a carrier through a temporary bonding layer, and wherein a front side of the portion of the wafer is bonded to the temporary bonding layer;
- thereafter etching the portion of the wafer from the back side until the portion of the wafer reaches a predetermined thickness that is in a range from about 10 nanometers to about 100 nanometers;
- and
- thereafter performing a heating process or an ultraviolet curing process to de-bond the temporary bonding layer from the portion of the wafer, thereby forming a pellicle with a de-bonded portion of the wafer.
A method, comprising:
- providing a wafer, the wafer containing a substrate, an insulator layer disposed over the substrate, and an epi-layer disposed over the insulator layer;
- dicing the wafer into a plurality of pieces, wherein at least one of the pieces has a lateral geometry that matches a lateral geometry of an opening defined by a frame holder for an extreme ultraviolet (EUV) lithography mask;
- grinding the at least one of the pieces of the wafer from a back side;
- thereafter inserting the grinded piece of wafer into the opening defined by the frame holder, wherein the frame holder is attached to a carrier through an adhesive layer, and wherein the inserting is performed such that a front side of the grinded piece of wafer is attached to the adhesive layer;
- thereafter etching the grinded piece of wafer from the back side until the piece of wafer reaches a predetermined thickness;
- and
- thereafter performing a heating process or an ultraviolet curing process to separate the etched piece of wafer from the adhesives layer, wherein the etched piece of wafer serves as a pellicle membrane for the EUV mask.
A method, comprising:
- providing a portion of a wafer;
- grinding the portion of the wafer from a back side of the portion of the wafer;
- after the grinding, inserting the portion of the wafer through an opening defined by a frame holder, wherein the frame holder is attached to a carrier through a bonding layer;
- coupling the portion of the wafer to the bonding layer;
- and
- decoupling the portion of the wafer and the frame holder from the bonding layer, thereby forming a pellicle that includes at least the decoupled portion of the wafer.
Dependencies are inferred from the claim text.