Multipass transfer surface for dynamic assembly

A microassembly system, comprising:

• an assembly surface having a first two dimensional array of electrodes on a first surface;
• a first voltage source electrically connected to the first array of electrodes to form potential wells;
• an intermediate transfer surface having a second two dimensional array of electrodes on a second surface arranged to face the first surface and positioned to receive an assembly from the assembly surface;
• and
• a second voltage source electrically connected to the second array of electrodes to form potential wells, such that the second voltage source is to generate an electrostatic field to attract the assembly from the assembly surface without mechanical transfer.

An intermediate transfer surface, comprising:

• a substrate;
• a two-dimensional array of electrodes on the substrate;
• a dielectric spacer layer on the two-dimensional array of electrodes;
• a local curing system that is paired with the transfer surface to direct electromagnetic energy at gaps between potential wells of the intermediate transfer surface;
• and
• a voltage controller electrically connected to the array of electrodes, wherein the intermediate transfer surface is positioned to receive an assembly having a registration from an assembly surface and the voltage controller is to generate an electrostatic field to attract the assembly from the assembly surface without mechanical transfer such that the registration is maintained.