Stacked semiconductor die assemblies with support members and associated systems and methods

A method of manufacturing a semiconductor die assembly, the method comprising:

• attaching a first semiconductor die to a package substrate;
• positioning a first support member and a second support member on opposite sides of the first semiconductor die, wherein the first support member is substantially parallel to the second support member, and wherein the first support member is flush with a first border of a footprint of a second semiconductor die and the second support member is flush with a second border of the footprint of the second semiconductor die, wherein positioning the first support member and the second support member includes—
• covering a semiconductor wafer with a die-attach material;
• cutting the semiconductor wafer to form elongate semiconductor members each having a portion of the die-attach material attached thereto;
• and
• attaching the elongate semiconductor members to the package substrate via the portion of the die-attach material attached to each of the elongate semiconductor members;
• positioning a third support member that is substantially perpendicular to the first and second support members, wherein the third support member is positioned wholly within the footprint of the second semiconductor die and set back from a closest border of the footprint of the second semiconductor die by a distance, and wherein the third support member is spaced apart from each of the first and second support members by a gap;
• attaching the second semiconductor die to the first, second, and third support members such that the first, second, and third support members carry the second semiconductor die above the first semiconductor die;
• forming wirebonds electrically coupling bond pads of the package substrate to corresponding bond pads of the second semiconductor die;
• and
• attaching a third semiconductor die to the second semiconductor die via an over-wire material, wherein a portion of the wirebonds extend into the over-wire material.