Method of forming semicondcutor device package

A method of forming a semiconductor device package comprising:

• forming a redistribution structure on a carrier;
• disposing a plurality of second semiconductor devices on the redistribution structure;
• disposing a first semiconductor device on the redistribution structure;
• forming an encapsulating material on the redistribution structure to encapsulate the first semiconductor device and the second semiconductor devices;
• disposing at least one warpage adjusting component over the encapsulating material and at least one of the second semiconductor devices;
• removing the carrier to reveal a bottom surface of the redistribution structure;
• and
• forming a plurality of electrical terminals on the bottom surface of the redistribution structure.

A method of forming a semiconductor device package comprising:

• forming a redistribution structure;
• disposing a plurality of second semiconductor devices on the redistribution structure;
• disposing at least one warpage adjusting component on at least one of the second semiconductor devices;
• disposing a first semiconductor device on the redistribution structure;
• and
• forming an encapsulating material on the redistribution structure to encapsulate the first semiconductor device, the second semiconductor devices and the warpage adjusting component.