Package structure and method of manufacturing the same

A package structure, comprising:

• a die having a first connector;
• an encapsulant, laterally encapsulating sidewalls of the die;
• a RDL structure disposed over the die and the encapsulant, wherein the RDL structure comprises:
• a dielectric layer on top surfaces of the die and the encapsulant;
• and
• a via embedded in the dielectric layer and located on the first connector, wherein an area of a bottom surface of the via is larger than an area of a top surface of the via, and the bottom surface is in contact with and electrically connected to the first connector, wherein the via comprises a first seed layer and a first conductive layer on the first seed layer, and a portion of a top surface of the first seed layer is in contact with the dielectric layer;
• and
• a second connector disposed on and connected to the RDL structure.

A method of manufacturing a package structure, comprising:

• forming an encapsulant aside a die having a first connector, so as to laterally encapsulating sidewalls of the die;
• forming a RDL structure on the die and the encapsulant, wherein RDL structure comprises a dielectric layer on top surfaces of the die and the encapsulant;
• and a redistribution layer penetrating through the dielectric layer to connect to the die, the forming the RDL structure comprising:
• forming at least one elongated via located on and connected to the first connector, wherein the at least one elongated via comprises a first seed layer and a first conductive layer on the first seed layer;
• forming the dielectric layer, such that the at least one elongated via is embedded in the dielectric layer;
• and
• forming at least one trace extending on and in contact with top surfaces of the at least one elongated via and the dielectric layer, the at least one trace comprises a second seed layer and a second conductive layer on the second seed layer, wherein the second seed layer is separated from the first seed layer by the first conductive layer therebetween;
• and
• forming a second connector over and connected to the RDL structure,
• wherein the elongated via comprises an elongated bottom surface contacting and extending along a top surface of the first connector, the elongated bottom surface comprises a length extending along a first direction and a width extending along a second direction perpendicular to the first direction,
• wherein the length of the elongated bottom surface is larger than the width of the elongated bottom surface.