US 10,504,864 B2Granted

Adhesive composition, electronic-component-mounted substrate and semiconductor device using the adhesive composition

AssigneeHitachi Chemical Company, Ltd.

InventorsKaoru Konno, Hiroki Hayashi, Takashi Kawamori

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Abstract

There are provided are an adhesive composition that keeps storage stability and further gives a cured product wherein metallic bonds are formed in the state that the cured product wets its components and is satisfactorily spread between the components (or parts), thereby turning excellent in adhesive property, electroconductivity, and reliability for mounting such as TCT resistance or high-temperature standing resistance; an electronic-component-mounted substrate using the same; and a semiconductor device. The adhesive composition comprises electroconductive particles (A) and a binder component (B), wherein the electroconductive particles (A) include a metal (a1) having a melting point equal to or higher than the reflow temperature and containing no lead, and a metal (a2) having a melting point lower than the reflow temperature and containing no lead, and the binder component (B) includes a thermosetting resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2).

Claims12

Dependent claims

An electronic component structure that two or more electronic components are bonded to each other through an adhesive composition, wherein the adhesive composition comprises electroconductive particles (A) and a binder component (B),

wherein the electroconductive particles (A) comprise a metal (a1) having a melting point equal to or higher than a reflow temperature and containing no lead, and a metal (a2) having a melting point lower than the reflow temperature and containing no lead, and
the binder component (B) comprises a thermosetting resin composition (b1) and an aliphatic dihydroxycarboxylic acid (b2) represented by the following general formula (1):
wherein R1 is an alkyl group which may have a substituent, and n and m are each an integer of 0 to 5,
wherein the thermosetting resin composition (b1) comprises an epoxy resin, and
wherein the content of the aliphatic dihydroxycarboxylic acid (b2) is 0.1 part or more by weight and 20 parts or less by weight for 100 parts by weight of the metal (a2) having the melting point lower than the reflow temperature and containing no lead.

2 more elements

Dependencies are inferred from the claim text.

Facts

Application: 14/963,292Filed 9 Dec 2015 · division
Priority: JP 2007-2597393 Oct 2007
Published: US 2016/0093584 A131 Mar 2016
Granted: 10 Dec 2019
Term ends: Not estimatedThe source records don’t support an estimate.

Classification39 codes

B23K 35/302
With the principal constituent melting at less than 1550°C: cu as the principal constituent
B22F 1/10
Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties: metallic powder containing lubricating or…
B22F 1/103
Metallic powder containing lubricating or binding agents; Metallic powder containing organic material: containing an organic binding agent…
B23K 35/0244
For use in soldering or brazing: powders, particles or spheres; Preforms made therefrom

Family

PCT/JP2008/067911Parent of this division · filed 2 Oct 2008
US 2016/0093584 A1Pre-grant publication · published 31 Mar 2016
Application12/680,923Parent of this division
US 9,247,652 B2Parent of this division
US 2010/0221559 A1Published application
US 10,504,864 B2This patent

From the US filing history. Foreign family members aren’t listed.

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