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US 10,504,853 B2Granted
Electronic device capable of suppressing electromagnetic radiation and manufacturing method thereof
AssigneeRealtek Semiconductor Corp.
InventorsHsiao-Tsung Yen, Yuh-Sheng Jean, Ta-Hsun Yeh
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Abstract
An electronic device includes a first semiconductor die, a plurality of bumps, and a substrate. The first semiconductor die includes a first conductive feature. The bumps are disposed on the first semiconductor die and are connected to the first conductive feature. The substrate includes a second conductive feature. The bumps are electrically connected to the second conductive feature. The first conductive feature, the bumps, and the second conductive feature are configured to form at least one ring structure.
Claims13
An electronic device, comprising:
- a first semiconductor die comprising:
- a first electromagnetic radiation source structure;
- a second electromagnetic radiation source structure;
- and
- a first conductive feature that is between the first and second electromagnetic radiation source structures and is substantially a straight line having a linewidth greater than linewidths of the first and second electromagnetic radiation source structures;
- a plurality of bumps disposed on the first semiconductor die and connected to the first conductive feature;
- and
- a substrate comprising a second conductive feature, wherein the bumps are electrically connected to the second conductive feature and are directly in contact with the first and second conductive features, and the first conductive feature, the bumps, and the second conductive feature are configured to form at least one ring structure.
5 more elements
Dependencies are inferred from the claim text.