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US 10,504,848 B1Granted
Chip embedded integrated voltage regulator
AssigneeFaraday Semi, Inc.
InventorParviz Parto
Life of this patent
Estimating the term…
Abstract
One or more chip-embedded integrated voltage regulators (“CEIVR's”) are configured to provide power to a circuit or chip such as a CPU or GPU and meet power delivery specifications. The CEIVR's, circuit or chip, and power delivery pathways can be included within the same package. The CEIVR's can be separate from the circuit or chip.
Claims30
A method for delivering electrical power, the method comprising:
- receiving electrical power having a first voltage;
- modifying the electrical power using a power converter to provide electrical power having a second voltage lower than the first voltage;
- delivering the electrical power having the second voltage to a processor package that comprises:
- an interposer;
- a computer processor mounted onto the interposer;
- and
- a plurality of chip-embedded voltage regulators on the interposer, wherein the plurality of chip-embedded voltage regulators are coupled in parallel and are electrically coupled to the computer processor through the interposer, and wherein each of the plurality of chip-embedded voltage regulators comprises:
- chip-embedded circuitry including a plurality of power switches configured to modify electrical power;
- and
- an inductor coupled to the chip-embedded circuitry, wherein a footprint of the inductor at least partially overlaps a footprint of the chip-embedded circuitry;
- modifying the electrical power provided to the processor package using the plurality of chip-embedded voltage regulators to provide electrical power having a third voltage lower than the second voltage;
- and
- delivering the electrical power having the third voltage to the computer processor through the interposer.
10 more elements
A packaged electronic device comprising:
- a semiconductor die in a package;
- a package substrate coupled to the semiconductor die and coupling the semiconductor die to package outputs;
- and
- a chip-embedded power converter that is separate from the semiconductor die, wherein the power converter includes:
- an input port configured to receive an input power;
- an output port;
- chip-embedded circuitry including a plurality of power switches configured to cause a modified power to be provided at the output port;
- an inductor coupled to the plurality of power switches;
- and
- an output capacitor coupled to the plurality of power switches;
- wherein the power converter is configured to deliver the modified power within the package to the semiconductor die;
- and
- wherein the semiconductor die, the package substrate, and the power converter are included in the same package.
10 more elements
A method for assembling a chip-embedded integrated voltage regulator for a package, the method comprising:
- providing a package substrate having an electrical connection arrangement for coupling a first semiconductor die to at least one of package inputs or package outputs;
- providing a chip-embedded power converter within the package, wherein the chip-embedded power converter includes at least power switches in a second semiconductor die that is chip-embedded;
- and
- coupling, within the package, an output of the chip-embedded power converter to provide power to the first semiconductor die.
1 more element
Dependencies are inferred from the claim text.