Semiconductor package and method of forming the same
OwnerShun-Ping Huanginventor
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Abstract
An embodiment method includes providing a fan-out package structure having cavities to confine semiconductor dies by applying adhesive material which has similar coefficient of thermal expansion (CTE) with semiconductor dies in the gap between the edges of dies and the edges of cavities. The method further includes forming a molding compound over a fan-out package structure with semiconductor dies, building fan-out redistribution layers over a fan-out package structure with semiconductor dies and electrically connected to the semiconductor dies.
Claims13
A method of forming a semiconductor package, comprising:
- attaching a fan-out package structure to a carrier, the fan-out package structure having a cavity formed thereon;
- disposing at least one die in the cavity of the fan-out package structure;
- after the at least one die is disposed in the cavity of the fan-out package structure, filling an adhesive in the cavity of the fan-out package structure to surround the at least one die, wherein the adhesive has a coefficient of thermal expansion (CTE) that is smaller than 10 ppm/° C.;
- hardening the filled adhesive to fix the at least one die in the cavity of the fan-out package structure;
- forming a molding compound over the fan-out package structure;
- and
- removing the carrier.
A method of forming a semiconductor package, comprising:
- attaching a fan-out package structure to a first carrier, the fan-out package structure having a cavity formed thereon;
- disposing at least one die in the cavity of the fan-out package structure;
- after the at least one die is disposed in the cavity of the fan-out package structure, filling an adhesive in the cavity of the fan-out package structure to surround the at least one die, wherein the adhesive has a coefficient of thermal expansion (CTE) that is smaller than 10 ppm/° C.;
- hardening the filled adhesive to fix the at least one die in the cavity of the fan-out package structure, wherein a first package comprising the fan-out package structure and the at least one die is formed, the first package having opposing first surface and second surface, the second surface being attached to the first carrier;
- removing the first carrier;
- attaching the first surface of the first package on a second carrier;
- forming a molding compound over the first package;
- and
- removing the second carrier.
Dependencies are inferred from the claim text.