Semiconductor package and semiconductor module including the same

A semiconductor package, comprising:

• a semiconductor chip;
• a first substrate having a first top surface on which the semiconductor chip is mounted and a first bottom surface opposite to the first top surface;
• a second substrate having a second top surface facing the first bottom surface and a second bottom surface opposite to the second top surface;
• a first metal pattern layer on the first top surface, the first metal pattern layer including a chip connection region at which the semiconductor chip is electrically connected to the first metal pattern layer and an upper connection region dedicated for electrically connecting the semiconductor package to an external electrical device, the upper connection region located along a section of the first top surface;
• a second metal pattern layer on the first bottom surface and electrically connected to the first metal pattern layer;
• and
• a third metal pattern layer on the second bottom surface and electrically connected to the second metal pattern layer, the third metal pattern layer having a lower connection region on a section of the second bottom surface, the lower connection region dedicated for electrically connecting another external electrical device to the semiconductor package,
• wherein the first metal pattern layer comprises a plurality of first metal patterns comprising leads extending in a longitudinal direction on the first top surface,
• the first metal patterns are disposed in a plurality of groups on the chip connection region,
• in each of the groups of the first metal patterns, the first metal patterns are spaced relative to each other in a direction intersecting the longitudinal direction in which the leads of the first metal pattern layer extend, whereas the groups of the first metal patterns are offset from each other in the longitudinal direction in which the leads of the first metal pattern layer extend,
• the second metal pattern layer comprises a plurality of second metal patterns on the first bottom surface,
• the third metal pattern layer comprises a plurality of third metal patterns comprising leads extending longitudinally on the second bottom surface, and
• in each of the groups of the third metal patterns, the third metal patterns are spaced relative to each other in a direction intersecting the longitudinal direction in which the leads of the third metal pattern layer extend, whereas the groups of the third metal patterns are offset from each other in the longitudinal direction in which the leads of the third metal pattern layer extend.