Integrated circuit package with enhanced cooling structure

An integrated circuit package comprising:

• a single integrated circuit die comprising first and second circuit regions and a surface;
• a cooling structure on the surface of the integrated circuit die, wherein the cooling structure comprises a plurality of micropipe interconnects arranged to form a cooling channel that allows for the flow of coolant, and wherein the cooling channel comprises:
• a first sub-channel having a first size between a first subset of the micropipe interconnects for cooling the first circuit region using the coolant;
• and
• a second sub-channel having a second size between a second subset of the micropipe interconnects for cooling the second circuit region using the coolant, wherein the second size is different than the first size;
• an inlet port connected to the cooling structure for admitting the coolant to pass through the first and second sub-channels in the cooling channel of the cooling structure, wherein the inlet port is positioned next to the first circuit region;
• and
• an outlet port connected to the cooling structure for expelling the coolant out of the first and second sub-channels in the cooling channel of the cooling structure, wherein the outlet port is positioned next to the second circuit region,
• wherein the first circuit region of the integrated circuit die generates a higher heat density than the second circuit region of the integrated circuit die when the integrated circuit die is operating, wherein the micropipe interconnects in the first subset each have a first diameter, and wherein the micropipe interconnects in the second subset each have a second diameter that is different than the first diameter such that the first subset of the micropipe interconnects permit the flow of coolant at a higher volume to cool the first circuit region than the flow of coolant permitted by the second subset of the micropipe interconnects to the second circuit region.