Back to results
US 10,504,810 B2Granted
Polymer-based-semiconductor structure with cavity
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Hung-Yi Kuo, Hao-Yi Tsai
Life of this patent
Estimating the term…
Abstract
A structure includes a device die, and an encapsulating material encapsulating the device die therein. The encapsulating material has a top surface coplanar with a top surface of the device die, and a cavity in the encapsulating material. The cavity penetrates through the encapsulating material.
Claims20
A method comprising:
- encapsulating a device die in an encapsulating material;
- planarizing a top surface of the device die with a top surface of the encapsulating material;
- forming at least one dielectric layer over the encapsulating material and the device die;
- forming a plurality of redistribution lines in the at least one dielectric layer, wherein the plurality of redistribution lines is electrically coupled to the device die;
- and
- removing a portion of the encapsulating material and the at least one dielectric layer to form a cavity penetrating through the at least one dielectric layer and the encapsulating material.
3 more elements
A method comprising:
- forming a dielectric buffer layer over a carrier;
- plating a coil over the dielectric buffer layer;
- placing a device die over the dielectric buffer layer;
- encapsulating the coil and the device die in an encapsulating material;
- forming a redistribution line connecting the coil to the device die;
- and
- forming a through-opening penetrating through the encapsulating material, wherein the forming the through-opening comprises removing a portion of the encapsulating material.
4 more elements
A method comprising:
- forming a dielectric buffer layer over a carrier;
- forming a coil over the dielectric buffer layer;
- encapsulating the coil in an encapsulating material;
- forming a plurality of dielectric layers over the coil and the encapsulating material;
- demounting the dielectric buffer layer, the coil, and the encapsulating material from the carrier to form a package;
- forming an opening in the package, wherein the opening extends into the plurality of dielectric layers and the encapsulating material;
- and
- inserting a discrete device into the opening.
5 more elements
Dependencies are inferred from the claim text.