Semiconductor package with electrical test pads
AssigneeSTMicroelectronics S.r.l.
InventorFederico Giovanni Ziglioli
Life of this patent
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Abstract
One or more embodiments are directed to semiconductor packages that include conductive test pads that are electrically coupled to, but distinct from, the leads of the package. In one embodiment the test pads are located on the plastic packaging material, such as encapsulation material, of the package and are electrically coupled to the leads of the package by traces. The traces may also be located on the packaging material and portions of the leads. In one embodiment, all of the test pads are located on a single surface of the packaging material of the package, which may allow for ease of electrical testing of the package.
Claims11
A semiconductor package comprising:
- a semiconductor die;
- a plurality of leads, the semiconductor die electrically coupled to the plurality of leads;
- a packaging material around the semiconductor die and first portions of the plurality of leads, second portions of the plurality of leads extending from side surfaces of the packaging material;
- a plurality of test pads of conductive ink located directly on an outer exposed surface of the packaging material;
- and
- a plurality of traces of conductive ink having first ends on the second portions of the plurality of leads and second ends coupled to the plurality of test pads, portions of the plurality of traces being located directly on the packaging material.
A semiconductor package comprising:
- a semiconductor die;
- a die pad, the semiconductor die mounted to the die pad;
- a plurality of leads, the semiconductor die electrically coupled to the plurality of leads;
- encapsulation material around the semiconductor die and first portions of the plurality of leads, second portions of the plurality of leads extending from side surfaces of the encapsulation material;
- a plurality of test pads of conductive ink located directly on an upper surface of the encapsulation material;
- and
- a plurality of traces of conductive ink coupling the second portions of the plurality of leads to the plurality of test pads, the plurality of traces being directly on second portions of the plurality of leads, side surfaces of the encapsulation material, and on an upper surface of the encapsulation material.
Dependencies are inferred from the claim text.