Method of examining defects in a semiconductor specimen and system thereof
AssigneeApplied Materials Israel Ltd.
InventorsYotam Sofer, Ariel Hirszhorn
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AssigneeApplied Materials Israel Ltd.
InventorsYotam Sofer, Ariel Hirszhorn
Estimating the term…
There is provided a method of examining defects in a semiconductor specimen and a system thereof. The method comprises: processing a first defect map obtained for a first semiconductor specimen to assign cluster-seed (CS) scores to at least some of the classified defects presented therein, wherein a CS score of a given defect is indicative of a number of neighboring defects classified to the same class as the given defect; upon obtaining a second defect map for a second semiconductor specimen, using the CS scores assigned to the at least some of the classified defects presented in the first defect map to select, among defects presented in the second defect map, defects for review, wherein the first defect map and the second defect map present respective defects in an attribute hyperspace; and reviewing defects selected in the second defect map, thereby obtaining classified defects presented in the second semiconductor specimen.
An examination system comprising:
A method comprising:
A non-transitory computer readable medium comprising instructions that, when executed by a processor, cause the processor to perform operations comprising:
Dependencies are inferred from the claim text.