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US 10,504,804 B2Granted
Laser processing method, substrate dicing method and substrate processing system for performing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsJin-Yeol Yang, Hyung-Su Son, Hae-Gu Lee, Dong-Su Han
Life of this patent
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Abstract
A laser processing method includes irradiating a laser light into a substrate along a cutting line to form a laser-scribed layer within the substrate, irradiating an X-ray onto a first surface of the substrate along the cutting line, obtaining an image of a diffracted X-ray from the substrate, and determining whether or not the laser-scribed layer is formed along the cutting line, based on analysis of the obtained image of the diffracted X-ray.
Claims20
A laser processing method, the method comprising:
- irradiating a laser light into a substrate along a cutting line to form a laser-scribed layer within the substrate;
- irradiating an X-ray onto a first surface of the substrate along the cutting line;
- obtaining an image of a diffracted X-ray from the substrate;
- and
- determining whether or not the laser-scribed layer is formed along the cutting line, based on analysis of the obtained image of the diffracted X-ray.
2 more elements
A substrate dicing method, the method comprising:
- irradiating a laser light into a substrate along a cutting line to form a laser-scribed layer within the substrate;
- irradiating an X-ray onto a first surface of the substrate along the cutting line;
- obtaining an image of a diffracted X-ray from the substrate;
- determining whether or not the laser-scribed layer is formed along the cutting line, based on analysis of the obtained image of the diffracted X-ray;
- and
- grinding the first surface of the substrate.
3 more elements
Dependencies are inferred from the claim text.