Loading patent…
AssigneeTokyo Electron Limited
InventorsYuichi Takenaga, Takahito Kasai
Estimating the term…
Disclosed is a substrate processing system that performs a film deposition on plural substrates in a processing container using a film deposition condition calculated based on a characteristic of a film deposited on at least one of the substrates. The substrate processing system includes: a storage unit storing surface state information and arrangement state information that represent influences of a surface state of the one substrate and an arrangement state of the plural substrates on the characteristic of the film deposited on the one substrate, respectively; a calculation unit calculating information that represents an influence of the plural substrates on the characteristic of the film on the one substrate based on the surface state information and the arrangement state information stored in the storage unit; and a correction unit correcting the characteristic of the film deposited on the one substrate based on the information calculated by the calculation unit.
A substrate processing system that performs a film deposition processing on a plurality of substrates accommodated in a processing container, the substrate processing system comprising:
A controller configured to control a substrate processing apparatus, the substrate processing apparatus configured to perform a film deposition processing on a plurality of substrates accommodated in a processing container, the controller comprising:
A film deposition method of performing a film deposition processing on a plurality of substrates accommodated in a processing container using a film deposition condition calculated based on a characteristic of a film deposited on at least one substrate among the plurality of substrates, the film deposition method comprising:
Dependencies are inferred from the claim text.