Direct transfer apparatus for a pattern array of semiconductor device die

An apparatus for simultaneously transferring a plurality of semiconductor device die (“die”) from a wafer tape having a first side and a second side to a product substrate having a circuit trace thereon, the plurality of die being disposed on the first side of the wafer tape, the apparatus comprising:

• a first frame configured to hold the wafer tape;
• a second frame configured to clamp the product substrate such that the circuit trace is disposed facing the plurality of die on the wafer tape;
• a transfer element disposed adjacent the second side of the wafer tape, a single tip end of the transfer element having a footprint sized so as to span across a group of die of the plurality of die, wherein the tip end is the furthest distal end of the transfer element and the group of die includes more than one die;
• and
• an actuator connected to the transfer element to move the transfer element to a die transfer position at which the transfer element presses on the second side of the wafer tape to press each die of the group of die on the wafer tape into contact with the circuit trace on the product substrate, thereby transferring the group of die simultaneously onto the product substrate.