Carrier substrate assembly, and fabrication method of flexible display substrate

A carrier substrate assembly configured for lamination and subsequent lifting-off of a flexible thin film, comprising a carrier substrate and the flexible thin film laminated over an upper surface of the carrier substrate, wherein:

• the carrier substrate has a central region with a plurality of through-holes and a peripheral region surrounding the central region;
• the plurality of through-holes provide passageways for a reaction solution to facilitate separation of the flexible thin film laminated over the upper surface of the carrier substrate from the carrier substrate during the lifting-off of the flexible thin film;
• the carrier substrate assembly further comprises an adhesive layer;
• the adhesive layer is disposed between, and bonds, the carrier substrate and the flexible thin film during the lamination of the flexible thin film;
• the adhesive layer is capable of being separated from the flexible thin film during the lifting-off of the flexible thin film;
• the carrier substrate assembly further comprises an infiltration film;
• and
• the infiltration film is disposed on an inner wall of each of the plurality of through-holes, and has a selective permeability for different solutions such that a treatment solution is blocked from coming into contact with the adhesive layer as a result of a contact angle of the treatment solution over a surface of the infiltration film being greater than 90°, and the reaction solution is capable of infiltrating over the surface of the infiltration film and spreading out, thereby passing through the through-holes and coming into contact with the adhesive layer, as a result of a contact angle of the reaction solution over the surface of the infiltration film being less than or equal to 90°.