Systems and methods for improved semiconductor etching and component protection

A semiconductor processing system comprising:

• a remote plasma source;
• a delivery tube coupled with the remote plasma source;
• an adapter on which the remote plasma source is seated, wherein the adapter defines a port through the adapater, and wherein the delivery tube extends through a central aperture of the adapter;
• an insert positioned within the delivery tube, wherein the insert provides access from the remote plasma source to a mixing region defined within the insert, and wherein the port defined through the adapter provides fluid access through the insert to the mixing region of the insert;
• and
• a semiconductor processing chamber, wherein the semiconductor processing chamber comprises:
• a gas box coupled about a distal region of the delivery tube,
• a first annular support contacting the gas box at a first surface of the first annular support, wherein the first annular support and the gas box together define a first channel about an interior region of the semiconductor processing chamber, and
• a gas distribution plate seated within the first channel.