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US 10,504,753 B2Granted
Brush cleaning apparatus, chemical-mechanical polishing (CMP) system and wafer processing method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChang-Sheng Lin, Hsin-Hsien Lu
Life of this patent
Estimating the term…
Abstract
A brush cleaning apparatus includes a wafer support configured to support a wafer, and at least one cleaning brush moveable relative to the wafer support. The at least one cleaning brush has opposite first and second sides, and, on the first side, a planar cleaning surface configured to come into contact with the wafer supported by the wafer support to remove contaminants from the wafer.
Claims20
A brush cleaning apparatus, comprising:
- a wafer support configured to support a wafer;
- at least one planar cleaning brush moveable relative to the wafer support, the at least one planar cleaning brush having opposite first and second sides, and on the first side, a planar cleaning surface defined by a layer of porous material and configured to come into contact with the wafer supported by the wafer support to remove contaminants from the wafer, wherein an entirety of the planar cleaning surface of the at least one planar cleaning brush is configured to simultaneously contact the wafer;
- on the second side, a layer of core material having a first flat surface attached to the layer of porous material and having a second flat surface facing away from the layer of porous material;
- and
- wherein interior sidewalls of the layer of core material and the layer of porous material are aligned along lines to collectively define a plurality of holes respectively extending through both the layer of porous material and the layer of core material, wherein the plurality of holes are arranged in circular patterns, when viewed from a top-view of the at least one planar cleaning brush, which are concentric about a point at the center of the at least one planar cleaning brush.
2 more elements
A brush cleaning apparatus, comprising:
- a wafer support configured to support a wafer;
- at least one cleaning brush comprising a porous material having a planar cleaning surface configured to come into contact with the wafer supported by the wafer support to remove contaminants from the wafer, wherein the planar cleaning surface is disposed along an uppermost surface of the porous material and extends as a continuous surface between outermost sidewalls of the porous material and wherein the porous material is coupled to a core material having interior sidewalls that define a plurality of holes arranged in circular patterns that are concentric about a center of the planar cleaning surface when viewed from a top-view of the planar cleaning surface;
- a moving mechanism configured to cause a relative translational movement between the wafer and the cleaning brush;
- and
- at least one nozzle configured to supply a cleaning liquid between the wafer and the cleaning brush.
2 more elements
A brush cleaning apparatus, comprising:
- a wafer support configured to support a wafer;
- a planar cleaning brush moveable relative to the wafer support, the planar cleaning brush having opposite first and second sides;
- wherein the first side comprises a planar cleaning surface defined by a planar topmost surface of a layer of porous material and configured to come into contact with the wafer supported by the wafer support to remove contaminants from the wafer;
- wherein the second side comprises a planar bottommost surface of a layer of core material and faces away from the layer of porous material, the layer of core material further comprising a topmost surface attached to a bottommost surface of the layer of porous material;
- and
- wherein interior sidewalls of the layer of core material and the layer of porous material collectively define a plurality of holes respectively extending through both the layer of porous material and the layer of core material, wherein the plurality of holes are configured to transfer a cleaning liquid, which is dispensed directly onto the planar bottommost surface of the layer of core material, from the planar bottommost surface of the layer of core material to the planar topmost surface of the layer of porous material.
3 more elements
Dependencies are inferred from the claim text.