Integrated passive device package and methods of forming same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsFeng-Cheng Hsu, Shuo-Mao Chen, Jui-Pin Hung, Shin-Puu Jeng
Life of this patent
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Abstract
An embodiment device package includes a first die, a second die, and a molding compound extending along sidewalls of the first die and the second die. The package further includes redistribution layers (RDLs) extending laterally past edges of the first die and the second die. The RDLs include an input/output (I/O) contact electrically connected to the first die and the second die, and the I/O contact is exposed at a sidewall of the device package substantially perpendicular to a surface of the molding compound opposite the RDLs.
Claims20
A method comprising:
- encapsulating a plurality of passive device dies and an additional passive device die in a first molding compound, wherein all dies encapsulated by the first molding compound are substantially free of any active regions;
- forming first redistribution layers (RDLs) extending laterally past edges of the plurality of passive device dies;
- singulating the plurality of passive device dies from the additional passive device die by applying a dicing process through a conductive via of the first RDLs;
- and
- bonding a substrate to the first RDLs using one or more solder regions, wherein the first RDLs electrically connects the plurality of passive device dies to the substrate.
A package comprising:
- a first die encapsulated in a first molding compound;
- a second die encapsulated in a second molding compound, the first molding compound contacting the second molding compound;
- a first conductive feature extending at least from a topmost portion of the first molding compound to a bottommost portion of the first molding compound, the first conductive feature is electrically connected to the first die by a first redistribution layer (RDL);
- and
- a second conductive feature extending at least from a topmost portion of the second molding compound to the bottommost portion of the second molding compound, the first conductive feature is directly bonded to the second conductive feature, the second conductive feature is electrically connected to the second die by a second RDL, and wherein the first die and the second die are both disposed between the first RDL and the second RDL.
A package comprising:
- a first passive device die;
- a second passive device die;
- a molding compound encapsulating the first passive device die and the second passive device die;
- a conductive line electrically connecting the first passive device die to the second passive device die;
- an input/output contact forming an interface with the conductive line;
- and
- a solder region bonding the first passive device die and the second passive device die to a substrate, wherein the solder region extends along sidewalls of the conductive line and the input/output contact, and wherein the interface between the input/output contact and the conductive line extends to the solder region.
Dependencies are inferred from the claim text.