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US 10,504,748 B2Granted
Method of packaging a power amplifier module having a unified pattern and ceramic sidewall
AssigneeCenter for Integrated Smart Sensors Foundation
InventorsKyung Hak Lee, Min Seok Han, Young Ki Kim
Life of this patent
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Abstract
Disclosed is a method of packaging a power amplifier module. The method of packaging a power amplifier module includes providing a unified pattern including a ceramic layer and a pattern formed on the ceramic layer, bonding the unified pattern on a metal layer, and depositing a ceramic sidewall, on which at least one external signal connection lead line is formed, on the unified pattern bonded the metal layer.
Claims4
A method of packaging a power amplifier module, comprising:
- providing a unified pattern comprising a ceramic layer and a pattern formed on and above the ceramic layer;
- bonding the unified pattern on a metal layer;
- depositing a ceramic sidewall, on which at least one external signal connection lead line is formed, directly on and above and in physical contact with the ceramic layer included in the unified pattern bonded on the metal layer, wherein a hole is formed in the ceramic sidewall;
- forming a metal line above the ceramic sidewall;
- disposing an insulating layer between the ceramic sidewall and the metal line and between the at least one external signal connection lead line and the metal line;
- forming at least one vertical via plug within the hole to thereby connect the at least one external signal connection lead line to the pattern, wherein the at least one external signal connection lead line is configured to connect to an external device;
- and
- mounting a cover on the metal line formed on the ceramic sidewall deposited on the ceramic layer included in the unified pattern bonded on the metal layer;
- wherein the metal layer includes at least one connection frame connecting the power amplifier module to an other module.
6 more elements
Dependencies are inferred from the claim text.