Methods of enhancing surface topography on a substrate for inspection

A method for manufacturing a structure on a substrate, comprising:

• processing a surface of a substrate, the substrate including a shallow trench isolation structure and a diffusion region;
• wet processing the substrate to enlarge a defect caused by processing the surface, wherein the defect is enlarged between about 20 percent and 60 percent from its original dimension;
• and
• inspecting the structure to detect the enlarged defect.

A method for manufacturing a structure on a substrate, comprising:

• performing a CMP process on a surface of a substrate having a shallow trench isolation structure and a diffusion region;
• wet treating the surface of the substrate to enlarge a structure selected from the group consisting of scratches, convex regions, concave regions, dishing defects and erosion defects in at least one of the shallow trench isolation structure or the diffusion region, wherein the structure is enlarged between about 20 percent and 60 percent from its original dimension;
• and
• inspecting the shallow trench isolation structure or the diffusion region including the enlarged structure to detect the enlarged structure, the enlarged structure having a shape selected from the group consisting of polygon, pyramids, cylinder, notch, cubic, and angled sidewalls.