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US 10,504,736 B2Granted
Plating interconnect for silicon chip
AssigneeTexas Instruments Incorporated
InventorsJerard Canuto Malado, Antonio Rosario Taloban, Jr.
Life of this patent
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Abstract
A system, method, and silicon chip package for providing connections between a die of a silicon chip package and external leads of the silicon chip package is disclosed. The connections are formed using a pre-mold etched with a trace pattern. The trace pattern provides rigid traces that connect the die with the external leads.
Claims13
A silicon chip package comprising:
- a front assembly having lead fingers, the lead fingers having a first end that is closest to the front assembly and a second end that is furthest from the front assembly;
- a die attached on the front assembly;
- a plastic pre-mold formed over the die and a portion of the first end of the lead fingers;
- rigid traces formed into the plastic pre-mold, every portion of the rigid traces lying at or below a top surface of the plastic pre-mold, the rigid traces providing continuous interconnections between the die and the first end of the lead fingers;
- and
- a mold formed over the rigid traces, the plastic pre-mold, and a portion of the first end of the lead fingers, the mold not contacting any portion of the second end of the lead fingers.
3 more elements
A semiconductor die package comprising:
- a die pad;
- a semiconductor die attached to the die pad;
- a plurality of lead fingers extending away from the die pad, each lead finger having a first end formed above the die pad and having a second end formed below the die pad;
- a pre-mold material formed over the semiconductor die and a portion of the first end of each lead finger;
- a plurality of rigid traces formed in the pre-mold material to connect the respective first end of each lead finger to the semiconductor die, every portion of the plurality of rigid traces lying at or below a top surface of the plastic pre-mold;
- and
- a mold formed over the rigid traces, the pre-mold material, and a portion of the first end of the lead fingers, the mold not contacting any portion of the second end of each lead finger.
4 more elements
Dependencies are inferred from the claim text.