Conductive material formulation and use thereof
AssigneeEternal Material Co., Ltd.
InventorShinn-Horng Chen
Life of this patent
Estimating the term…
Abstract
The invention pertains to a conductive material formulation comprising: (a) a conductive polymer material; and (b) an insulation material, wherein the conductive polymer material is derived from a conductive polymer and a polyanion and has a weight average molecular weight ranging from 3,000 to 30,000; and wherein the (b) insulation material is present in an amount of 0.01 part to 200 parts by weight based on 100 parts by weight of the (a) conductive polymer material. The conductive material formulation according to the invention is useful for the preparation of solid capacitors.
Claims13
A conductive material formulation, comprising a plurality of separate components including:
- (a) a first solution comprising a conductive polymer material, and
- (b) a second solution comprising an insulation material,
- wherein the conductive polymer material is derived from a conductive polymer and polyanion,
- wherein the conductive polymer comprises a polymerization unit derived from a monomer of formula (I):
- wherein
- A is C1 to C4 alkylene substituted with (R)p,
- X is O or S,
- R is H, unsubstituted or substituted C1 to C20 alkyl or alkoxy, or unsubstituted or substituted C6 to C20 aryl, and
- p is 0, 1 or 2, and
- the conductive polymer has a weight average molecular weight in the range of 3,000 to 30,000, wherein the (b) insulation material is a non-conjugated polymer selected from the group consisting of polyethylene, polypropylene, carboxymethyl cellulose, polyethylene glycol, polyacrylamide and polytetrafluoroethene (Telfon);
- and wherein the (b) insulation material has a content of about 0.01 to about 50 parts by weight, based on 100 parts by weight of the (a) conductive polymer material.
Dependencies are inferred from the claim text.