Multilayer ceramic electronic component

A multilayer ceramic electronic component comprising:

• a ceramic body including dielectric layers and pluralities of first and second internal electrodes alternately stacked in a thickness direction and respectively exposed to first and second end surfaces opposing each other in a length direction of the ceramic body with each of the dielectric layers interposed therebetween;
• and
• first and second external electrodes disposed on outer surfaces of the ceramic body to be connected to the first and second internal electrodes, respectively, and disposed to cover at least a portion of eight corners of the ceramic body,
• wherein the first and second external electrodes include, respectively, first and second base electrode layers at least partially in contact with the outer surfaces of the ceramic body and first and second plating layers disposed to cover the first and second, base electrode layers, respectively,
• at least one of the first and second plating layers has at least one hole therein positioned in at least one of the eight corners of the ceramic body,
• each hole of the at least one hole does not extend to a point of a respective edge of the ceramic body at which the respective edge meets a virtual line extending in the thickness direction and drawn through an end in a width direction of an exposed edge of one of the first or second internal electrodes exposed in the first or second end surfaces,
• each of the first and second internal electrodes extends in a plane extending in width and length directions, and a thickness of each of the first and second external electrodes in a respective center of a respective [width×thickness] surface is 10 μm or less,
• at least one of the first and second base electrode layers has at least one hole positioned at one or more points of the at least one of the first and second base electrode layers overlapping with the at least one hole in the at least one of the first and second plating layers,
• the first and second external electrodes further include, respectively, first and second conductive resin layers disposed between the first and second base electrode layers and the first and second plating layers, respectively, and
• at least one of the first and second conductive resin layers has at least one hole positioned at one or more points of the at least one of the first and second conductive resin layers overlapping with the at least one hole in the at least one of the first and second plating layers.