Classification, search and retrieval of semiconductor processing metrology images using deep learning/convolutional neural networks
AssigneeApplied Materials, Inc.
InventorsSreekar Bhaviripudi, Shreekant Gayaka
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Abstract
A method of classifying substrates with a metrology tool is herein disclosed. The method begins by training a deep learning framework using convolutional neural networks with a training dataset for classifying image dataset. Obtaining a new image from the meteorology tool. Running the new image through the deep learning framework to classify the new image.
Claims20
A method of classifying substrates with a metrology tool comprising:
- providing a machine learning model trained to classify features in images, the machine learning model trained with a first training image data set;
- processing a new image obtained from a substrate with the metrology tool, by extracting a new image feature using the machine learning model;
- classifying the new image feature using a classification algorithm, such that a matching image from the first training image data set is returned that contains a matching feature that resembles the new image feature;
- and
- determining, from the matching image, quality information regarding the substrate.
A non-transitory computer-readable medium comprising instructions that, when executed by a processor of a processing system, cause the processing system to perform a method of classifying substrates with a metrology tool, the method comprising:
- providing a machine learning model trained to classify features in images, the machine learning model trained with a first training image data set;
- processing a new image obtained from a substrate with the metrology tool, by extracting a new image feature using the machine learning model;
- classifying the new image feature using a classification algorithm, such that a matching image from the first training image data set is returned that contains a matching feature that resembles the new image feature;
- and
- determining, from the matching image, quality information regarding the substrate.
Dependencies are inferred from the claim text.