Photosensitive material and method of lithography

A method, comprising:

• forming a photosensitive layer over a substrate, wherein the photosensitive layer comprises a polymer chain and an additive component, wherein the additive component includes:
• a metal selected from the group consisting of Cs, Ba, La, and Ce;
• and
• a protecting group bonded to the metal by a first bond;
• a polymer chain bonding component bonded to the metal by a second bond, the polymer chain bonding component being further bonded to the polymer chain of the photosensitive layer by a third bond, wherein the protecting group includes the following chemical formula:
• wherein includes a carbon chain including a carbon number between 1 and 10, the being bonded to the metal by the first bond, wherein R3 includes a material selected from the group consisting of —S—, —P—, —P(O2)—, —C(═O)S—, —C(═O)O—, —O—, —N—, —C(═O)N—, —SO2O—, —SO2S—, —SO—, —SO2—, and combinations thereof, and wherein R4 includes a tertiary carbon;
• selectively exposing the photosensitive layer to a radiation beam;
• and
• applying a developer to the photosensitive layer, wherein the developer removes regions of the photosensitive layer exposed to the radiation beam.

A method of making a semiconductor device, the method comprising:

• providing a semiconductor substrate;
• forming a layer including a metal additive component and a floating additive component over the semiconductor substrate, wherein the metal additive component includes a metal cation, and wherein the forming the layer further includes:
• forming one or more bonds bonding the metal cation and one or more anions, wherein each of the one or more anions is one of a protecting group and a polymer chain bonding component, wherein the polymer chain bonding component is bonded to a polymer chain of the layer;
• and
• exposing the layer to a radiation beam,
• wherein prior to the exposing the layer to the radiation beam, the metal additive component exhibits hydrophobic properties, and
• wherein after the exposing the layer to the radiation beam, the metal additive component in regions of the layer exposed to the radiation beam exhibits hydrophilic properties.