Method of fabricating patterned structure
AssigneesUnited Microelectronics Corp., Fujian Jinhua Integrated Circuit Co., Ltd.
InventorsFeng-Yi Chang, Fu-Che Lee
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AssigneesUnited Microelectronics Corp., Fujian Jinhua Integrated Circuit Co., Ltd.
InventorsFeng-Yi Chang, Fu-Che Lee
Estimating the term…
A method of fabricating a patterned structure includes the following steps. A first pattern transfer layer and a second pattern transfer layer are formed on a material layer. A part of the second pattern transfer layer is patterned to be a first pattern. A first spacer is formed on sidewalls of the first pattern. The first pattern transfer layer is patterned to be a second pattern and a third pattern. A cover layer is formed covering the first pattern, the first spacer, the second pattern, and the third pattern. A part of the cover layer is removed for exposing the first pattern and the first spacer. The first spacer is removed, and a patterning process is performed to the first pattern transfer layer with the first pattern and the cover layer as a mask. The second pattern is patterned to be a fourth pattern by the patterning process.
A method of fabricating a patterned structure, comprising:
Dependencies are inferred from the claim text.