Photosensitive resin composition, photosensitive dry film, photosensitive resin coating, and pattern forming process
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsHitoshi Maruyama, Kazunori Kondo, Hideyoshi Yanagisawa
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Abstract
A photosensitive resin composition comprising (A) a silicone-modified polybenzoxazole resin and (B) a photoacid generator which is decomposed to generate an acid upon exposure to radiation of 190-500 nm is coated onto a substrate to form a thick coating, which is exposed to radiation, baked, and developed to form a pattern. The resin coating is capable of forming a fine pattern and has improved crack resistance and other film properties, and reliability.
Claims12
A photosensitive resin composition comprising (A) a silicone-modified polybenzoxazole resin comprising repeating units having the formula (1a) and repeating units having the formula (1b), and (B) a photoacid generator which is decomposed to generate an acid upon exposure to radiation of wavelength 190 to 500 nm,
- wherein R1 to R4 are each independently a C1-C8 monovalent hydrocarbon group which may contain a glycidyl, acryloyl or methacryloyl moiety, m and n are each independently an integer of 0 to 300, R5 is a straight, branched or cyclic C1-C8 alkylene group or phenylene group, a and b are positive numbers in the range:
- 0<a<1, 0<b<1, and a+b=1, and X1 is a divalent linker having the following formula (2):
- wherein X2 is a single bond or divalent organic group, R11 is each independently hydrogen or a C1-C8 monovalent hydrocarbon group in which some hydrogen may be substituted by halogen, R12 is each independently a straight, branched or cyclic C1-C8 alkylene group in which any methylene moiety may be substituted by an ether bond or phenylene moiety, R13 is each independently a hydroxyl or glycidyloxy group, R14 is each independently a C1-C8 monovalent hydrocarbon group in which some hydrogen may be substituted by halogen, p and q are each independently an integer of 0 to 4, and r and s are each independently an integer of 0 to 3.
A photosensitive resin coating comprising (A) a silicone-modified polybenzoxazole resin comprising repeating units having the formula (1a) and repeating units having the formula (1b), and (B) a photoacid generator which is decomposed to generate an acid upon exposure to radiation of wavelength 190 to 500 nm,
- wherein R1 to R4 are each independently a C1-C8 monovalent hydrocarbon group which may contain a glycidyl, acryloyl or methacryloyl moiety, m and n are each independently an integer of 0 to 300, R5 is a straight, branched or cyclic C1-C8 alkylene group or phenylene group, a and b are positive numbers in the range:
- 0<a<1, 0<b<1, and a+b=1, and X1 is a divalent linker having the following formula (2):
- wherein X2 is a single bond or divalent organic group, R11 is each independently hydrogen or a C1-C8 monovalent hydrocarbon group in which some hydrogen may be substituted by halogen, R12 is each independently a straight, branched or cyclic C1-C8 alkylene group in which any methylene moiety may be substituted by an ether bond or phenylene moiety, R13 is each independently a hydroxyl or glycidyloxy group, R14 is each independently a C1-C8 monovalent hydrocarbon group in which some hydrogen may be substituted by halogen, p and q are each independently an integer of 0 to 4, and r and s are each independently an integer of 0 to 3.
Dependencies are inferred from the claim text.