Testing equipment for semiconductor element and its carrying device
AssigneesGlobal Unichip Corporation, Taiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Chieh Liao, Yu-Min Sun, Chih-Feng Cheng
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AssigneesGlobal Unichip Corporation, Taiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Chieh Liao, Yu-Min Sun, Chih-Feng Cheng
Estimating the term…
A carrying device includes a main body, a grasping portion, a heat-exchanging module and a gas chamber device. The grasping portion is connected to the main body for grasping a semiconductor element. The heat-exchanging module is disposed on the main body. The gas chamber device includes a case body and a gas. The case body is disposed between the grasping portion and the heat-exchanging module, and has a closed chamber therein. The gas fills the closed chamber for transferring heat from the semiconductor element to the heat exchanging module, in which a specific heat capacity of the gas is about between 5000 J/(kg·K)-15000 J/(kg·K).
A carrying device, comprising:
Dependencies are inferred from the claim text.